by Lyle Smith

Samsung Announces Production Of the PM1643, The Industry’s Largest Capacity SAS SSD

Samsung Electronics has announced the production of the PM1643, touted as the industry’s largest capacity SAS SSD at 30.72TB, which is double the capacity and performance of the previous 15.36TB high-capacity lineup released back in March 2016. The PM1643 uses Samsung's latest V-NAND technology with 64-layer, 16 stacked layers of 512Gb V-NAND chips.

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by Adam Armstrong

Intel Introduces Its New P4510 Series SSD

Today Intel introduced its new data center SSD that it is calling “cloud inspired, storage optimized,” the Intel SSD DC P4510 Series. The new drive series offers up to 8TB in capacity and better performance and QoS than the previous version. Intel is also announcing broad industry collaboration on its EDSFF, or ruler, form factor.

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by Lyle Smith

SK Hynix Announces New Enterprise SSDs with 72-Layer 512Gb 3D NAND

SK Hynix has announced they have recently completed the development of an enterprise SATA SSD, marking the company’s entrance into this high value-added market. The new enterprise drive is equipped with 72-Layer 512Gb 3D NAND flash chips, an in-house firmware and controller, and is offered in a maximum capacity of 4TB.

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by Adam Armstrong

Samsung Introduces 800GB Z-SSD

Today Samsung Electronics Co., Ltd. launched a 800GB version of its Z-SSD, SZ985. This new drive is aimed at use cases such as artificial intelligence (AI), big data, high performance computing (HPC), and Internet of Things (IoT) applications. The new 800GB, as well as the 240GB version, of the Z-SSD will be introduced at ISSCC 2018 in February 11-15 in San Francisco.

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by Adam Armstrong

Micron Releases First 64-Layer Enterprise SATA SSD

Today Micron Technologies announced the new 5200 series of SATA SSDs aimed at enterprise use. The 5200 Series is the first enterprise SSDs leveraging Micron’s 64-layer 3D NAND technology. The drive will be released in two flavors: ECO for scalability and PRO for write-intensive workloads.

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by Adam Armstrong

Seagate Details Its Nytro 3000 SSD Line

Announced back in August of 2017, the Seagate Nytro 3000 SAS SSD line came with lots of promise but few details. A replacement for the 1200.2, the new line had capacities as high as 15TB and performance claims of 2.2GB/s sequential read. The company has finally released a more details about the drive.

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by Adam Armstrong

HGST Ultrastar SS200 (Mixed Workloads) Review

With high capacity (up to 7.68TB for the read-intensive version) the HGST Ultrastar SS200 SSDs are aimed at the enterprise looking to expand its flash footprint or go all-flash. Not just sporting a high capacity, the drives are also able to hit up to 1.8GB/s in sequential read and up to 250K IOPS in random read. The drive was released in two flavors, though the name is the same SS200, a mixed workload and a read-intensive version.

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by Adam Armstrong

HGST Ultrastar SS200 (Read-Intensive Workloads) Review

At the very tail end of last year, HGST released a slew of new drives for its investor day. One of the drives announced was the Ultrastar SS200. The SS200 is an 2.5” SAS SSD aimed at enterprise. The drives are all about capacity (with the upper capacity being 7.68TB) and performance. HGST states that the drives are able to hit up to 250K IOPS read and 86K IOPS write (for the read intensive drive) for a random 70/30 4KiB test. There are two types of drives in the family, though they all have the same moniker, an endurance or write optimized and a capacity or mixed workloads optimized.

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by Adam Armstrong

Intel Doubles Capacity For Its Optane DC P4800X SSD

Today Intel announced that it has doubled the capacity for its data center Optane DC P4800X SSD. The drive will soon be available in both HHHL AIC and a hot-swappable 2.5” U.2 form factor in both its initial 375GB capacity and the new 750GB capacity. The introduction of higher capacities and new form factors make this drive a more attractive option for data centers.

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by Adam Armstrong

Intel Shows Off New Tech & Ships 1st 64-Layer 3D NAND For Data Center

Last week at the Intel Technology and Manufacturing Day held in Beijing, China, the company gave updates on some of its new technology. Some of the new technology showcased included power and performance updates for Intel’s 10 nm process, high-level plans for Intel’s first 10 nm FPGA, and an announcement the company is shipping the industry’s first commercially available 64-layer 3D NAND for data center applications.

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