October 22nd, 2015 by Adam Armstrong
Toshiba Announces New NAND Flash Memory Products for Embedded Applications
Toshiba America Electronic Components, Inc. announced a new family of NAND flash memory products for embedded applications, Toshiba’s Serial Interface NAND. The Serial Interface NAND family is compatible with Serial Peripheral Interface (SPI), and has a wide range of use-cases including flat screen TVs, printers, wearable devices, and robots. The Serial Interface NAND family consists of 12 products; includes three densities (1Gb, 2Gb and 4Gb); two packages (WSON and SOP); and two power supply voltages.
As larger memory densities are required for the enhanced features that are now found in embedded devices, the demand is moving away from the standard NOR memory to SLC NAND flash memory. With is compatibility with SPI, Toshiba’s Serial Interface NAND family can be controlled with 6-pins and be utilized as SLC NAND flash memory.
- Uses 24nm process technology for SLC NAND
- Compatible with the widely used SPI, which can be controlled with a low pin count of 6-pins
- Available in small and versatile packages. The WSON package size is 6.0mm×8.0mm and the SOP package size is 10.3mm×7.5mm. Products in the BGA*3 package are also under development, with sample shipments scheduled for the first quarter (Jan.-Mar.) of 2016. The packages and the pin assignments are compatible with common serial flash memories.
- Embedded ECC (Error Correction Code) with bit flip count report function
- Embedded data protection features
- Density: 1Gbit / 2Gbit / 4Gbit
- Page Sizes: 2KByte (1Gbit, 2Gbit), 4KByte (4Gbit)
- Interface: Serial Peripheral Interface Mode 0, Mode 3
- I/O: x1, x2, x4
- Voltages: 2.7-3.6V, 1.7-1.95V
- Operating Temperature Range: -40°C to 85°C
- Packages:8pin WSON (6mm × 8mm) & 16pin SOP (10.3mm × 7.5mm)
- High speed sequential read function
- ECC function (ON/OFF, bit flip count report)
- Data protection function (able to protect specific blocks)
- Parameter page function (able to output detailed information on the device)
Toshiba is already shipping samples of the new NAND family with mass production scheduled to begin in December 2015.