February 6th, 2017 by Adam Armstrong
WD Introduces 512Gb, 64-Layer 3D NAND Chip
Today Western Digital Corp. introduced what it is referring to as the world’s first 512Gb 64-layer 3D NAND chip. WD states that it has begun its pilot production of the new NAND chip and intends to enter mass production in the second half of this year. The release of this chip, the first of it’s kind to market, is the result of nearly 30 years of flash technology development.
Back in July, WD announced that it had developed the world’s first 64-layer 3D NAND it calls BiCS3. The development was a result of WD’s work on flash as well as its manufacturing partnership with Toshiba and its acquisition of SanDisk. The initial BiCS3 NAND chips were 256Gb. While WD was the first to announce 64-layer, they were soon joined by Samsung.
The announcement today shows a doubling in capacity from six months ago. With a 512Gb NAND chips, WD will have a leg up on competition, as the market is demanding higher density in a smaller footprint. WD was the first to bring both 64-layer and 48-layer 3D NAND technology to market. The company will continue to ship both technologies to OEM customers, and, as stated, will start mass production of the latest capacity later this year.