January 8th, 2019 by Adam Armstrong
Intel Makes CPU Announcements At CES
At CES 2019 in Las Vegas, Intel made several announcements including a few around processor innovations. The company announced details on its first volume 10nm Pc processor, Ice Lake. Intel previewed Lakefield, its hybrid 10nm CPU architecture with Foveros 3D packaging. The company is also expanding its 9th Gen Core desktop CPUs as well.
Code-named Ice Lake, Intel upcoming 10nm processor is aimed at mobile PCs. Ice Lake is built off of the Sunny Cove CPU microarchitecture and according to Intel, is expected to deliver a new level of technology integration on a client platform. Ice Lake will have Gen11 integrated graphics architecture and support Intel Adaptive Sync technology that will enable smooth frame rates and be capable of more than 1 TFLOP of performance for richer gaming and creation experience. Ice Lake is also said to be the first to integrate Thunderbolt 3, Wi-Fi 6 wireless standard, and Intel DL Boost to accelerate AI workloads. Along with all of the above benefits, Ice Lake is said to help increase battery life as well. Intel will be rolling out a server version of Ice Lake as well, aimed at 2020.
Intel previewed its upcoming “Lakefield” hybrid CPU architecture also. Lakefield leverages Foveros 3D packaging technology and comes with five cores, one Sunny Cove ore and four Atom cores. This tiny CPU gives OEMs more flexibility for thin and light products. It also offers power savings with better graphics, increasing battery life.
Intel is following up its October release of 9th Gen Intel Core desktop processors with new additions to the family. The new additions run the gamut of users from the casual users to professional gamers and content creators.
Ice Lake is expected to begin showing up in new devices from OEM partners by the holiday of 2019. Lakefield is expected to go into production sometime this year. The new 9th Gen Intel Core desktop CPUs are expected this month with more coming out in the second quarter of 2019.