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Smart IOPS Introduces Unobtanium FN SSD

Today Smart IOPS announced its new NVMe SSD geared towards the Storage Class Memory (SCM) market, Unobtanium FN. The new SSDs leverage Toshiba’s XL-Flash technology and come in capacities ranging from 800GB to 3.2TB. Smart IOPS will be demoing Unobtanium FN at Flash memory Summit 2019 from August 6 to August 8, at Booth Number 609.

Excelero Debuts NVEdge

Today Excelero announced its new block storage software that its states can create NVMe all-flash arrays from high-availability servers, Excelero NVEdge. Excelero, as it frequently does, claims that its new solution can create the world’s fastest NVMe AFA performance, with the numbers they claim being 2.7 million IOPS on a 100Gb link. Even though they promise high performance, they state they can hit it while still providing enterprise storage features for simplified deployment, efficiency and operation.

Liqid Releases New Honey Badger Gen4 NVMe

Today at the Flash Memory Summit, Liqid announced what it is calling the world’s fastest NVMe storage, Liqid Element LQD4500 PCIe Add-In-Card (AIC) or Honey Badger. The Element LQD4500 is a FHFL AIC that is ultra-thin and is based on Liqid’s award-winning composable fabric and software. The NVMe takes advantage of Gen 4 PCIe specifications and can deliver up to 4 million IOPS of random performance, over 24GB/s of throughput and less than 20ms. The device will be available in capacities as high as 32TB.

Intel Announces 56 Core Single-Socket Cooper Lake Processor

Today Intel announced that its future Intel Xeon Cooper Lake processor family will have server-centric versions with up to 56 cores per socket. The new processors have built-in, AI training acceleration.

Toshiba Introduces XFMEXPRESS Form Factor

Today Toshiba introduced a new form factor for NVMe memory devices, the XFMEXPRESS. The new form factor will be for flash memory devices and fall in between the M.2 and BGA categories. While there is a slew of potential use cases for such a form factor, it will be of particular interest to OEMs of embedded devices.

Samsung Begins Mass Producing 250GB SATA SSDs with 6th-gen 256Gb 3bit V-NAND

Samsung has started the mass production of 250GB SATA SSDs that integrate the company’s 6th-gen (1xx-layer) 256Gb 3bit V-NAND for global PC OEMs. With its ‘channel hole etching’ technology, Samsung indicates that the new V-NAND adds approximately 40% more cells to the previous 9x-layer single-stack structure. This is done by building an electrically conductive mold stack with 136 layers, then vertically piercing cylindrical holes from top to bottom, which creates a uniform 3D charge trap flash (CTF) cells.

Intel Expands Its FPGAs With HPE

Today Intel announced a new high-performance FPGA Programmable Acceleration Card, the Intel FPGA PAC D5005. Currently, Intel is working with Hewlett Packard Enterprise (HPE) providing the new card for this ProLiant DL380 Gen10 server. The combination of the two technologies is aimed at address computing-intensive markets such as streaming analytics, media transcoding, financial technology and network security.

Toshiba Announces Its Storage Class Memory, XL-FLASH

Today Toshiba memory America, Inc. announced the launch of its Storage Class Memory (SCM) solution, XL-FLASH. XL-FLASH is based off of Toshiba’s BiCS FLASH 3D flash memory technology with 1-bit-per-cell SLC. The new SCM technology aims to bring high performance to the enterprise while cost-effectively reducing latency. 

Dell Announces Disk Library for Mainframe 5.1

Today Dell EMC announced Disk Library for mainframe (Dlm) 5.1 at the SHARE 2019 conference. Disk Library for mainframe is Dell EMC's virtual tape library for IMB z systems and Unisys ClearPath Dorado mainframes. Dell EMC (EMC Corporation prior to their acquisition by Dell in 2016) provides data center services and products including servers, storage, and converged infrastructure.

Western Digital Launches 2 New NVMe SSD Families At FMS

Today at FMS 2019, Western Digital Corp (WDC) announced two new NVMe SSD families that leverage the company’s 96-layer 3D flash, the Ultrastar DC SN640 and Ultrastar DC SN340. The new drives are built for mixed-use-case workloads or very read-intensive applications, respectively. Aside from the NAND, the new drive families also leverage the company’s in-house SSD controller designs, firmware development and vertical integration.