CoolIT Systems OMNI All-Metal Coldplates Unveiled

CoolIT Systems, a leader in liquid cooling solutions, has unveiled OMNI All-Metal Coldplates featuring advanced Split-Flow technology. The development of all-metal coldplates is tailored to address the rigorous demands of AI, high-performance computing (HPC), and dense enterprise workloads, providing superior performance, reliability, and scalability.

CoolIT Systems, a leader in liquid cooling solutions, has unveiled OMNI All-Metal Coldplates featuring advanced Split-Flow technology. The development of all-metal coldplates is tailored to address the rigorous demands of AI, high-performance computing (HPC), and dense enterprise workloads, providing superior performance, reliability, and scalability.

Behind: OMNI Coldplates for NVIDIA GB200 Grace Blackwell Superchip. Front (left to right): OMNI Coldplates for NVIDIA H100 GPU, Intel Data Center Max Series GPU, NVIDIA GH200 Grace Hopper Superchip & 4th Generation Intel Xeon CPU.

The OMNI Coldplates are designed to efficiently manage extreme thermal loads, supporting thermal design power (TDP) exceeding 1,500 watts and thermal fluxes beyond 300 W/cm². They are compatible with CPUs and GPUs from major manufacturers such as NVIDIA, Intel, and AMD, making them versatile for various high-tech applications.

Patrick McGinn, Chief Operating Officer at CoolIT, expressed pride in the engineering team’s ability to enhance their industry-leading coldplate technology. The introduction of the OMNI platform with its patented Split-Flow technology not only elevates performance standards but also significantly accelerates the time-to-market for companies implementing direct liquid cooling (DLC) solutions.

CoolIT’s products are already used to cool over five million CPUs and GPUs globally, and the company is ramping up production to keep pace with the sharply rising demand for DLC servers. This demand is driven by increasingly powerful AI chips and denser computational workloads. Market research firm Omdia predicts a 44% annual growth in the data center liquid cooling market, expanding from just over $1 billion in 2023 to an estimated $4.87 billion by 2027.

Kamal Mostafavi, Vice President of Engineering at CoolIT, noted that the engineering team is actively collaborating with server OEMs and ODMs to integrate OMNI coldplate cooling loops into their DLC server product lines. He anticipates that systems equipped with OMNI Coldplates will begin to hit the market this summer.

The OMNI Coldplates are highly efficient at handling severe thermal challenges, offering up to 60% lower thermal resistance than standard coldplates, made possible through their Split-Flow technology. The coldplates are built with an all-metallic unibody design using aerospace-grade materials. This eliminates risks associated with differential coefficients of thermal expansion (CTE) that can occur when multiple materials are used. This design ensures intrinsic reliability and durability, even under intense operational conditions.

Ready for high-volume production and available for design integration today, OMNI Coldplates will commence shipping at scale from June 2024. This launch reinforces CoolIT Systems’ position as a pivotal player in the liquid cooling market. It marks a significant step forward in the company’s commitment to supporting next-generation computing technologies.

Incidentally, we’ve installed a small CoolIT loop in our lab, you can follow along on any of our social media accounts to keep up to date on the process!

Check out the CoolIT Systems site for more information.

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