JetCool Unveils Cold Plates for the NVIDIA H100 GPU

JetCool has launched an innovative liquid cooling module tailored for NVIDIA’s H100 SXM and PCIe GPUs, claiming a significant advancement in data center cooling technologies.

JetCool has launched a liquid cooling module tailored for NVIDIA’s H100 SXM and PCIe GPUs, claiming a significant advancement in data center cooling technologies. This module features their cutting-edge SmartPlate technology, engineered to dramatically improve cooling efficiency and establish a new standard in the industry. JetCool believes that this development is poised to transform the landscape of high-performance computing by providing more effective, energy-efficient cooling solutions that meet the rigorous demands of modern data centers.

The SmartPlate technology employs JetCool’s proprietary microconvective liquid cooling approach. This advanced system specifically targets heat generation points on the chip with fluid jets, enabling precision cooling that outperforms traditional methods. By focusing on single-phase, direct-to-chip liquid cooling, JetCool’s solution not only enhances computing speed but also significantly contributes to environmental sustainability. This technology has been validated to reduce the thermal resistance of NVIDIA’s H100 GPUs, demonstrating a staggering 82% improvement over conventional air cooling methods.

This release comes at a crucial time, as the demand for AI and high-performance computing surges, necessitating more effective and sustainable cooling solutions. With computational workloads expanding, the associated rise in energy consumption and heat output in data centers presents significant challenges. In this context, JetCool’s SmartPlate emerges as a potentially powerful solution, enhancing performance while also improving power efficiency and facilitating heat reuse.

With the ability to maintain optimal functionality even at coolant temperatures as high as 60°C under full load, the NVIDIA H100 SmartPlate marks an important shift in cooling technology. This drastically lowers the GPU temperatures by up to 35°C while using just 2% of the cooled power, also facilitating a quieter operation by reducing noise levels up to 13 dB.

Specifications of NVIDIA H100 SmartPlate

Feature	Specification
Technology	Patented single-phase direct-to-chip liquid cooling
Thermal Resistance	0.021 C/W at 3.2 LPM
Module Dimensions	150mm (L) x 78mm (W) x 30mm (H)
Module Weight	455g
Coolant Temperature / Max. Pressure Rating	10 – 60°C / 100 psi
Power Consumption	Reduces overall AI cluster power by 15%
Operational Noise Reduction	Decreases server noise levels by up to 13dB
Coolant Fluid	PG25

JetCool’s cooling technology significantly enhances GPU utilization and efficiency, demonstrating the impact of targeted cooling solutions in critical settings like data centers.

The NVIDIA H100 PCIe and NVIDIA H100 SXM5 JetCool SmartPlate models are now available.

Jetcool Liquid Cooling for NVIDIA H100 GPUs

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