KIOXIA has successfully demonstrated an E3.S full-function development vehicle in conjunction with a leading server original equipment manufacturer (OEM). This Enterprise and Datacenter SSD Form Factor (EDSFF), also known as E3, is designed to maximize system density, efficiency, and simplicity. It is purpose-built for servers and storage.
KIOXIA has successfully demonstrated an E3.S full-function development vehicle in conjunction with a leading server original equipment manufacturer (OEM). This Enterprise and Datacenter SSD Form Factor (EDSFF), also known as E3, is designed to maximize system density, efficiency, and simplicity. It is purpose-built for servers and storage.
KIOXIA, (formerly Toshiba Memory America, Inc.), says that new NVMe E3.S form factors will enable higher density and performance, driving enterprise data center efficiency. Additionally, they noted the EDSFF E3.Short (E3.S) and E3.Long (E3.L) solutions are the future of SSD storage for servers and All-Flash Arrays (AFAs) in cloud and enterprise data centers. Featuring a universal connector, this form factor standard for PCIe technology-based devices, allows a complete array of footprint, power, and capacity options, offering unprecedented system flexibility. The EDSFF E3.x supports higher power budgets (up to 40 watts) and better signal integrity to deliver the performance promised by PCIe Gen 5.0 and beyond. Furthermore, these SSD designs feature improved thermal characteristics that address the cooling challenges that come with game-changing speeds.
The KIOXIA EDSFF SSD full-function development vehicle is based on the E3.S thin (7.5mm) form factor, which offers increased flash storage density per drive for optimized power efficiency and rack consolidation. The drive features the same core components as the recently announced CM6 Series PCIe 4.0 NVMe 1.4 SSD and is configured with x8 lanes and up to 28W of power. Additional E3 size and width options will also be supported, including E3.S thick (16.8mm) and E3.L thin.
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