The new 64-layer NAND shows quite an advancement for WDC. Other vendors, such as Samsung, are currently using 48-layer NAND. The new BiCS3 and its 3-bits-per-cell technology is the result of a technology and manufacturing partnership with Toshiba as well as the acquisition of SanDisk late last year. WD also states that BiCS3 will feature advances in high aspect ratio semiconductor processing to deliver higher capacity, superior performance and reliability at an attractive cost.
Initial deployment of BiCS3 will be in 256 gigabit capacity, though WD will eventually have the 64-layer NAND in a range of capacities up to half a terabit on a single chip.
Availability
WD will begin OEM sampling of BiCS3 this quarter with volume shipments for the retail market expected in the fourth quarter of 2016. BiCS2 will continue to ship to retail and OEM customers.
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