Home Enterprise SK hynix PCB01 SSD for AI PCs Unveiled

SK hynix PCB01 SSD for AI PCs Unveiled

by Lyle Smith

At GTC 2024, SK hynix introduced the PCB01 SSD, promising a new standard in performance for AI-powered personal computers. The company confirmed its plan to complete the development of this PCIe Gen5 SSD within the first half of 2024, aiming to launch it later in the year. SK hynix also showcased the first volume-produced 12-layer High Bandwidth Memory 3E (HBM3E), marking a leap in memory technology innovation.

At GTC 2024, SK hynix introduced the PCB01 SSD, promising a new standard in performance for AI-powered personal computers. The company confirmed its plan to complete the development of this PCIe Gen5 SSD within the first half of 2024, aiming to launch it later in the year. SK hynix also showcased the first volume-produced 12-layer High Bandwidth Memory 3E (HBM3E), signifying a leap in memory technology innovation.

The PCB01 SSD is engineered for AI applications on personal computers and features potentially impressive performance metrics. It boasts the industry’s top sequential read speed at 14GB/s and a write speed of 12GB/s, effectively doubling the performance of its predecessors. This is crucial for supporting loading LLMs (large language models) required for AI learning and inference in less than one second.

SK hynix plans to release two versions of the PCB01, targeting major tech enterprises and the consumer market by year-end. This development is pivotal for AI PCs, facilitating the rapid data transfer from internal storage to DRAM for AI processing tasks. The PCB01’s design incorporates a 30 percent improvement in power efficiency over previous models. It integrates SLC caching technology, which helps to ensure optimal performance for AI computations and general PC operations.

Furthermore, the PCB01 introduction is anticipated to make waves in AI computing and the gaming and high-performance computing sectors.

SK hynix also highlighted advancements in memory technology at GTC 2024, including the 36GB, 12-layer HBM3E, showcasing the industry’s progression toward fifth-generation HBM solutions. The presentation also covered the next-generation GDDR7 technology, which doubles the bandwidth and improves power efficiency by 40 percent compared to its predecessor, GDDR6.

SK hynix

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