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Sandisk iNAND CL EM181 bringt 112-Layer-TLC auf e.MMC 5.1 mit bis zu 256 GB und 300 MB/s

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Sandisk has introduced the iNAND CL EM181, an e.MMC 5.1A embedded flash drive built on 112-layer 3D TLC NAND in 64GB, 128GB, and 256GB capacities. Announced at electronica 2026 in Munich, it is aimed at products that stay in production for years and still use e.MMC, including set-top boxes, home gateways, smart TVs, security cameras, and data center logging. Sandisk rates it at up to 300MB/s sequential read and 225MB/s sequential write.

Sandisk iNAND CL EM181 commercial e.MMC embedded flash drive, shown as two black BGA packages, the top one marked iNAND EM181 Commercial e.MMC and the lower one showing its ball grid

Capacity, Performance, and Endurance

The three capacities carry part numbers SDINBDC4-64G-B, SDINBDC4-128G-B, and SDINBDC4-256G-B. The interface is e.MMC 5.1A with HS400, which allows a bus transfer rate of up to 400MB/s, so the 300MB/s read rating uses three-quarters of what the bus can carry. The speed ratings come from Sandisk’s internal testing. The 112-layer TLC is a mature node next to the 332-layer BiCS10 that Sandisk and KIOXIA are now sampling; embedded parts usually favor long supply over the newest NAND.

For writes, Sandisk’s SmartSLC allocates SLC blocks within the NAND as a write buffer, which the company says raises burst write performance and endurance while reducing write amplification. A configurable Enhanced User Data Area (EUDA) goes further and gives designers a true SLC partition for data that needs higher endurance or performance.

“Many IoT products often remain in the market for years, so continuity of storage technology matters to manufacturers. The SANDISK iNAND CL EM181 gives customers a path to newer NAND technology while retaining the established e.MMC interface and reducing the changes required to existing designs,” said Russell Ruben, Worldwide Automotive and IoT Segment Marketing Director, Sandisk.

Package and Data Protection

All three capacities share a JEDEC-compatible 153-ball package measuring 11.5 x 13 x 1.0mm. Sandisk says the device is designed to let manufacturers move between iNAND generations with minimal host changes, which cuts the integration and qualification work needed to update an existing product line. It operates from -25°C to 85°C and includes an LDPC ECC engine, automatic refresh, advanced power protection, wear leveling, and block management.

Sandisk is showing the CL EM181 at electronica 2026 in Hall C4, Stand 126, and lists all three part numbers for quote requests through its reseller and business channels. The company has not given sampling or volume production timing, and it has not published endurance ratings.

Sandisk iNAND CL EM181 Product Page

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Harold Fritts

Ich bin in der Technologiebranche tätig, seit IBM Selectric gegründet hat. Mein Hintergrund ist jedoch das Schreiben. Also beschloss ich, aus dem Vorverkaufsgeschäft auszusteigen und zu meinen Wurzeln zurückzukehren, ein bisschen zu schreiben, mich aber immer noch mit Technologie zu beschäftigen.