Micron Technology has begun shipping qualification samples of its automotive-grade UFS 4.1 storage solution to customers globally. Unveiled at the Automotive Computing Conference in Munich, the new solution is built on Micron’s ninth-generation 3D NAND technology and designed to support the growing data demands of intelligent, AI-driven automotive systems.
Bandwidth and AI Data Handling
Micron’s automotive UFS 4.1 is spec’d to deliver 4.2GB/s of bandwidth, which doubles the performance of the previous UFS 3.1 generation. This boost in speed plays a crucial role in supporting advanced driver assistance systems (ADAS), autonomous vehicle platforms, and in-cabin AI features, such as voice control, tailored infotainment systems, and real-time safety alerts. The increased bandwidth also enables more efficient data offloading from sensors such as cameras, radar, and lidar to data centers for continuous AI model refinement.
Micron’s UFS 4.1 implementation is built with its latest G9 NAND, which enhances performance and meets the rigorous AEC-Q104 automotive qualification standard. This ensures the device is ready for deployment in the harsh operating conditions that vehicles often face, offering the reliability and safety compliance required by automotive OEMs and suppliers.
Designed to bring intelligent systems online quickly, the UFS 4.1 solution features proprietary firmware that enhances boot performance by 30% for devices and 18% at the system level, compared to Micron’s earlier UFS 3.1 devices. These faster boot times allow vehicles to become responsive immediately after ignition, improving the overall user experience in the cockpit.
For endurance, Micron’s automotive UFS 4.1 supports up to 100,000 program/erase cycles in single-level cell (SLC) mode, while triple-level cell (TLC) mode allows for 3,000 cycles. These figures are especially relevant for systems that continually log large volumes of data, such as those from imaging and sensing hardware in autonomous vehicles.
To handle the intense thermal environment of automotive electronics, the storage solution is rated for sustained performance across a case temperature range of -40°C to 115°C. This exceeds the JEDEC thermal rating of 105°C, providing manufacturers with greater flexibility in designing thermal management systems.
Advanced Host Features and System Optimization
Micron has also incorporated advanced host features in its UFS 4.1 solution, such as Host-Initiated Defragmentation. This optimizes storage efficiency by reducing fragmentation, especially during periods of high demand, helping maintain performance consistency across longer operational cycles.
For safety and cybersecurity, the solution complies with ISO 26262 standards at Automotive Safety Integrity Level B, indicating its readiness for functional safety applications. Software development processes have been aligned with ASPICE Level 3, and product security engineering follows ISO/SAE 21434 guidelines to ensure data protection and operational reliability in connected vehicles.
Beyond technical performance, the UFS 4.1 solution supports real-time telemetry and advanced health monitoring, allowing vehicle platforms to detect and address issues before they escalate. This functionality is especially valuable for predictive maintenance and fleet management systems, contributing to higher uptime and reduced operational risks.
Here’s a quick rundown of its features:
| Feature | Details |
|---|---|
| Product | Micron Automotive UFS 4.1 |
| Storage Technology | 9th-Generation 3D NAND (G9 NAND) |
| Sequential Bandwidth | Up to 4.2 GB/s |
| Device Boot Speed Improvement | 30% faster (vs. UFS 3.1) |
| System Boot Speed Improvement | 18% faster (vs. UFS 3.1) |
| Endurance (SLC / TLC) | 100,000 P/E cycles (SLC), 3,000 P/E cycles (TLC) |
| Operating Temperature Range | -40°C to 115°C |
| Automotive Standards Compliance | AEC-Q104, ISO 26262 (ASIL B), ASPICE Level 3, ISO/SAE 21434 |
| Advanced Features | Host-Initiated Defragmentation, Real-time telemetry, Health monitoring |
Availability
Micron showcased this new automotive-grade storage technology at the Automotive Computing Conference in Munich, with more information coming.



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