Lenovo is expanding its ThinkEdge portfolio with a new wave of AI-enabled systems that bring computing power from centralized data centers into the environments where data is created. The additions include the ThinkEdge SE10n Gen 2, ThinkEdge SE30n Gen 2, ThinkEdge SE60n Gen 2, and the ThinkEdge SE50a, the company’s first industrial all-in-one panel PC. Rather than sending every workload to the cloud, more organizations are analyzing data locally to reduce latency, improve resilience, and keep sensitive information on-site.
From Entry-Level Gateways to Advanced AI Systems
The new devices are powered by Intel Core processors with scalable AI options and feature fanless, industrial-grade designs for continuous 24/7 operation. Connectivity options include Wi-Fi 6E and cellular support. Lenovo also emphasizes long-term lifecycle support, enterprise services, and global supply chain capabilities to help customers deploy and maintain systems at scale for years.
The updated ThinkEdge portfolio covers a range of deployment options.
ThinkEdge SE10n Gen 2
The ThinkEdge SE10n Gen 2 is a compact, fanless intelligent gateway designed for connectivity, data capture, and lightweight analytics. It serves as an accessible starting point for organizations looking to introduce edge intelligence without a major upfront investment.
| ThinkEdge SE10n Gen 2 | |
|---|---|
| Performance | |
| Processor | Up to Intel Core 3 Processor N355 |
| Operating System | Win11 IoT LTSC 2024 Ubuntu Server / Ubuntu Core AWS GG / Red Hat Support Win10 driver |
| Memory | 1x DDR5 SoDIMM, up to 16GB |
| Storage | 1x M.2 Slot for SSD |
| PSU | Lockable DC 20V |
| Working Temperature | Up to 0°C to 50°C |
| Connectivity | |
| Front I/O | 2x USB2.0 2x USB3.2 Gen2 (10 Gbps) 1x Audio combo Jack 2x serial (RS-232/422/485) 1x Power Switch 1x Ext. Power Switch 1x Reset Switch 1x Power-On LED1 1x Storage LED2 1x Wi-Fi LED3 1x UDF (WWAN) LED4 |
| Rear I/O | 2x USB 3.2 Gen2 (10 Gbps) 1x DP1.4 1x HDMI 2.0b 2x 2.5G LAN AC PWR-in |
| Wireless | WWAN CAT6 & Wi-Fi 6/Bluetooth Combo |
| Software | |
| Software | Lenovo Device Orchestration (LDO) |
| Design | |
| Form Factor | 0.8L Fanless |
| Dimensions (W x D x H) | 179 x 135 x 34.5mm (7.04 x 5.3 x 1.36 in) |
| Weight | 1.5kg / 3.31 lbs |
| IP Rating | IP50 (optional) |
| Security | |
| Security | BitLocker NIST-compliant BIOS ThinkShield Secure Wipe TPM 2.0 Kensington Lock Smart USB Protection Tamper Switch |
| Certifications & Registries | |
| Certifications & Registries | MIL-STD- 810H CE.FCC Class B BSMI.CCC.CB ErP Lot 6 Low Halogen RoHS compliant REACH TED WEEE |
ThinkEdge SE30n Gen 2
The ThinkEdge SE30n Gen 2 is a rugged, AI-ready gateway built for real-time inferencing at the edge, right next to your operational equipment. Optimized for Intel Core processors, it’s engineered to streamline device orchestration and fleet-level management across distributed environments.
| ThinkEdge SE30n Gen 2 | |
|---|---|
| Performance | |
| Processor | Intel Core 7 150U Intel Core 5 120U Intel Core 3 100U |
| Operating System | Windows 11 IoT Enterprise LTSC Ubuntu Server Ubuntu Core No OS |
| Memory | 1x 262-Pin SoDIMM socket up to 48GB DDR5 4800MHz memory |
| Storage | 1x M.2 NVMe + 1x Optional M.2 SATA |
| PSU | Lockable DC 12V |
| Working Temperature | 0°C to 50°C |
| Connectivity | |
| Front I/O | 2x USB 2.0 1x Mic in + line out 2x serial (RS-232/422/485) |
| Rear I/O | 4x USB 3.2 Gen2 2x USB 3.2 Gen1 1x Lockable DC jack 4x HDMI 2.0b 1x Intel Ethernet connection I219-LM, 1G 1x Intel Ethernet controller I226-V, 2.5G Flexible I/O (DIDO/CAN) |
| Expansion Slot | 1x M.2 2280 PCIe 1x M.2 2230 Wi-Fi 1x M.2 3042 (WWAN or 2nd SSD slot) |
| Wireless | Intel Wi-Fi 6E (Intel vPro Essential/non-vPro) Bluetooth 5.4 WWAN (4G & 5G) |
| Software | |
| Software | Lenovo Device Orchestration |
| Design | |
| Form Factor | 0.8L Fanless |
| Mounting | VESA Mount (optional) DIN Rail Mount (optional) |
| Dimensions (W x D x H) | 174 x 125 x 38.7mm |
| Weight | Without package: 1.1kg With package: 2kg |
| IP Rating | IP50 |
| Security | |
| Security | Intel vPro Security HW TPM 2.0 chip HW Watchdog Timer Support for Kensington Lock |
ThinkEdge SE60n Gen 2
A higher-performance edge computing system aimed at more demanding AI workloads. Powered by Intel Core Ultra processors with integrated AI accelerators delivering up to 97 TOPS, it supports multi-camera computer vision, predictive analytics, and autonomous workflows across industrial automation, robotics, smart retail, healthcare, and transportation.
| ThinkEdge SE60n Gen 2 | |
|---|---|
| Performance | |
| Processor | Intel Core Ultra 7 265H Intel Core Ultra 5 235H Intel Core Ultra 5 125H |
| Operating System | Windows 11 IoT Enterprise LTSC Ubuntu core 24.04 Ubuntu server 24.04 |
| Graphics | Up to Intel Arc Graphics 8Xe |
| Memory | 2x 262-pin SODIMM socket Max. up to 64GB DDR5 5600 MT/s |
| Storage | 1x M.2 NVMe + 1x Optional SATA |
| PSU | DC 12-36V |
| Working Temperature | -20°C to 60°C |
| Connectivity | |
| Front I/O | 2x USB 2.0 2x RS232/422/485 1x DIO 1x External Power Switch |
| Rear I/O | 4x USB 3.2 Gen1 2x HDMI 2.0 1x DP 1.2 2x 2.5G LAN 12-36V DC-In 1x Mic-in + 1x line-out |
| Optional I/O | 4x RS232 + 2x USB 2.0 IET Module 4x LAN PoE IEEE 802.3af + 2x USB 2.0 IET Module 4x LAN + 2x USB 2.0 IET Module 4x USB 3.0 + 3x USB 2.0 IET Module |
| Expansion Slot | 1x 80-pin IET interface |
| Wireless | Intel Wi-Fi 6E (non-vPro) Bluetooth 5.4 |
| Software | |
| Software | Lenovo Device Orchestration |
| Design | |
| Form Factor | 2.1L Fanless 3.1L Fanless |
| Mounting | Wall Mount (default) DIN Rail Kit (optional) |
| Dimensions (W x D x H) | 240 x150 x 59mm (without I/O expansion) 240 x150 x 85 mm (with I/O expansion module) |
| Weight | Without package: Standard (2.1L): 2.3kg Expanded I/O (3.1L): 2.6kgWith package: Standard (2.1L): 3.7kg Expanded I/O (3.1L): 4.2kg |
| IP Rating | IP50 (with optional dust cover) |
| Security | |
| Security | Intel vPro Security TPM 2.0 chip |
ThinkEdge SE50a
Lenovo’s first industrial all-in-one panel PC embeds local AI processing directly into operator stations. Available in 12.1-inch, 15.6-inch, and 21.5-inch sizes, the rugged system is designed to simplify frontline operations while improving visibility and control at the point of interaction. It can also be expanded to meet specific deployment requirements.
| ThinkEdge SE50a | |
|---|---|
| Performance | |
| Processor | Up to Intel Core 7 processor |
| Operating System | Windows 11 IoT LTSC Ubuntu Desktop |
| Memory | 1x 262-Pin SoDIMM Socket up to 32GB DDR5 (4800MHz) |
| Storage | 1x M.2 Key M 2280 (PCI-e x4) slot for storage. 1x M.2 Key B 2242 for SATA |
| Graphics | Integrated Intel UHD Integrated Intel Iris Xe |
| Audio | Realtek ALC888S, 2×2 |
| PSU | +12V Lockable DC jack 120W, 12V/10A 50C adaptor |
| Working Temperature | 0°C to 50°C |
| Connectivity | |
| I/O | 3x USB3.2 + 1x USB2.0 1x USB-C 2x RJ-45 (Intel I225L 2.5G Ethernet) 1x RS-232/422/485 |
| M.2 | 1x M.2 Key B 3042/3052/2242 for SATA 1x M.2 Key M 2280 (PCI-e x4) slot for storage 1x M.2 Key E 2230 for Wi-Fi |
| Expansion Slots | 1x 80-pin IET interface |
| Wireless | Intel Wi-Fi 6E (non-vPro) Bluetooth 5.4 |
| Design | |
| Form Factor | All-in-one |
| Display | ThinkEdge SE50a-12: 12.1″ XGA 4:3; 1024 x 768 resolution; 600cd/m2 luminance; up to 10-point capacitive ThinkEdge SE50a-15: 15.6″ FHD 16:9; 1920 x 1680 resolution; 350 cd/m2 luminance; up to 10-point capacitive ThinkEdge SE50a-21: 21.5″ FHD 16:9; 1920 x 1680 resolution; 250 cd/m2 luminance; up to 10-point capacitive |
| Dimensions (W x D x H) | ThinkEdge SE50a-12: 293.77 x 226.31 x 54.5mm ThinkEdge SE50a-15: 391.2 x 293.2 x 61mm ThinkEdge SE50a-21: 538.05 x 341.05 x 64mm |
| Weight | Without package: ThinkEdge SE50a-12: 2.4 kg ThinkEdge SE50a-15: 3.7kg ThinkEdge SE50a-21: 7.3kg |
| IP Rating | Front panel IP65 Back cover IP41 |
| Mounting | Wall / Stand / VESA 75mm x 75mm, 100mm x 100mm Panel mount with mounting kits |
| Security | |
| Security | dTPM 2.0 chip |
| Software | |
| Software | Lenovo Device Orchestration |
Rather than relying solely on constant cloud connectivity, the new ThinkEdge systems are built to handle AI workloads directly on the device. This approach can reduce latency, enhance data privacy, and lower operational costs, particularly in environments where immediate response times matter. The portfolio is also designed to scale, allowing organizations to start with smaller deployments and expand as their edge use cases mature. Remote management capabilities are intended to simplify oversight of large fleets of distributed systems.
Showcase and Availability
Lenovo is showcasing the latest ThinkEdge devices at EuroShop 2026 in Düsseldorf, Germany, where the company is presenting a broader ecosystem of solutions and interactive demonstrations.
Availability timelines vary by model:
- ThinkEdge SE30n Gen 2 and ThinkEdge SE60n Gen 2 are scheduled to be available in select markets starting April 2026.
- ThinkEdge SE50n Gen 1 is expected in June 2026.
- ThinkEdge SE10n Gen 2 is scheduled to be available beginning July 2026.
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