Lenovo has launched an expanded range of data storage, virtualization, and data management services. These are aimed at enterprises and mid-sized companies looking to update their infrastructure for AI and advanced application workloads. The announcement highlights new Lenovo ThinkSystem and ThinkAgile solutions, along with an enhanced data management services portfolio, to create a more unified
The AMD EPYC Embedded 2005 Series is positioned for networking, storage, and industrial designs where power, thermal headroom, and board space are tightly constrained. The series focuses on high compute density and performance per watt in a compact 40 mm x 40 mm BGA package, targeting platforms that must operate continuously and deliver extended service
Enterprises are moving into a new phase of digital transformation. This phase focuses on deploying Agentic AI across their core business operations. Many organizations find it challenging to transition from isolated pilot projects to full production deployments. They struggle particularly with aligning AI to their specific business needs, governance standards, and existing infrastructure. At AWS
At AWS re:Invent, NVIDIA and Amazon Web Services announced an enhanced partnership focused on interconnect technology, cloud infrastructure, open models, and physical AI. This collaboration deepens NVIDIA’s integration with the AWS stack, covering custom silicon, networking, AI software, and robotics simulation. The focus is on production-scale AI and requirements for sovereign cloud. NVLink Fusion for
AMD, Broadcom, and HPE announced their collaboration to accelerate the next generation of open, scalable AI infrastructure powered by AMD computing technologies. HPE will be among the first system providers to adopt AMD’s “Helios” rack-scale AI architecture. This architecture will include a specially designed HPE Juniper Networking scale-up switch and software for easy, high-bandwidth Ethernet
We spent a week testing an HGX B200 through Supermicro JumpStart to see how remote bare-metal access speeds AI platform decisions.
Ecolab Inc., a global provider of water, hygiene, and infection prevention solutions, has introduced a fully integrated Cooling as a Service (CaaS) program to optimize cooling performance in data centers and high-performance computing environments worldwide. The program combines hardware, chemistry, digital monitoring, and field expertise into a single offering designed for next-generation, AI-intensive workloads. Ecolab
AMD, Cisco, and HUMAIN, a PIF-backed provider of full-stack AI solutions, have announced plans for a joint venture designed to build out large-scale AI infrastructure in the Kingdom of Saudi Arabia. The initiative aims to achieve up to 1 GW of AI capacity by 2030, targeting regional and global customers seeking cost-efficient, high-performance AI training
Cloudian has announced the general availability of the Cloudian HyperScale AI Data Platform, a turnkey stack that aligns closely with how customers want to deploy enterprise AI. Based on the NVIDIA AI Data Platform reference design, the solution turns decades of institutional knowledge stored in documents, PDFs, images, and spreadsheets into instantly accessible insights via
CoreWeave has introduced its Zero Egress Migration (0EM) program, a true no-egress-fee data migration offering designed for organizations moving large AI datasets from third-party clouds. The program allows customers to transfer data directly into CoreWeave’s cloud. At the same time, CoreWeave covers the egress charges for the initial migration of AI workloads from providers such
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