Home Enterprise Solidigm Is Borne Out Of SK hynix’s Intel NAND Acquisition

Solidigm Is Borne Out Of SK hynix’s Intel NAND Acquisition

by Harold Fritts

Following the recent merger clearance from China’s State Administration for Market Regulation, SK hynix has launched Solidigm Technology (pronounced saa-luh-dime) to manage the newly acquired Intel NAND and SSD technology. Solidigm will operate as a standalone U.S. subsidiary of SK hynix Inc. Based in San Jose, the new subsidiary will manage product development, manufacturing, and sales of the newly acquired Intel assets.

Following the recent merger clearance from China’s State Administration for Market Regulation, SK hynix has launched Solidigm Technology (pronounced saa-luh-dime) to manage the newly acquired Intel NAND and SSD technology. Solidigm will operate as a standalone U.S. subsidiary of SK hynix Inc. Based in San Jose, the new subsidiary will manage product development, manufacturing, and sales of the newly acquired Intel assets.

Solidigm logo

A market leader in NAND memory storage for the data center, Solidigm will become SK hynix’s go-to partner for customers in solid-state memory storage. The new company’s name reflects a commitment to creating a new solid-state storage paradigm. Rob Crooke, former senior vice president of Intel, will be appointed CEO of Solidigm.

With the first phase of the transaction complete, work is underway at Solidigm on a forward-moving strategy and product roadmap that will focus on growing the memory ecosystem to the benefit of customers, partners, and shareholders. Currently, the product portfolio includes the enterprise and client SSDs that had previously been in the market under the Intel flag. It remains to be seen how SK hynix will balance their own brand and line of SSDs and the Solidigm SSDs going forward.

What’s Next?

This second phase of the transaction between Intel and SK hynix, acquiring Intel’s remaining NAND assets, including IP related to the manufacture and design of NAND flash wafers, R&D employees for NAND flash wafers, the Dalian facility workforce, and the other associated tangible/intangible assets. The second phase is expected to close on or after March 2025, completing the deal with a final payment of $2 billion.

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