Today Toshiba America Electronic Components, Inc. (TAEC) announced its next generation single-package ball grid array (BGA) solid state drive (SSD) product line based on Toshiba’s latest 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH, the BG3 series. The new series is designed for mobile storage with the benefits of higher performance in a smaller footprint versus





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