Sandisk has taped out the first High Bandwidth Flash memory die. The company put it on a slide at its 2026 Investor Day on August 13, under the header HBF Roadmap, next to what the slide labels an actual die picture. The second half of that slide covers the first HBF inference product samples: coming
Enterprise SSD prices increased another 5 percent in July 2026, according to the latest VDURA Flash Volatility Index. While the monthly increase was lower than the extreme fluctuations seen over the past year, flash pricing remains approximately 6.5 times higher than it was in the third quarter of 2025. The index, which VDURA launched in
SK hynix and its subsidiary Solidigm are following a two-part manufacturing plan to keep mature flash production separate from next-generation memory. Recent updates show they are expanding older production capacity overseas while also investing heavily at home. These moves will support future demand for AI storage, but current production schedules mean that enterprise SSD shortages
AMD said it has achieved an estimated 4x increase in AI energy efficiency from 2024 to mid-2026, exceeding its projected 3x target for the period. It is working toward a 20x improvement in rack-scale AI training and inference efficiency by 2030, a goal it set in June 2025. The company measures progress against a 2024
Ubiquiti continues to expand its UniFi power ecosystem with the UPS 2U Pro, a higher-capacity rackmount UPS designed for larger network racks, storage systems, and other infrastructure that needs centralized power protection and management. Following the company’s initial entry into the UPS market with the UPS Tower and UPS 2U, the new Pro model builds
The HP EliteBook X G2i is HP’s premium 14-inch business notebook, and the company is not shy about the AI branding: the formal model name is the EliteBook X G2i 14-inch Notebook Next Gen AI PC. Our review unit runs Intel’s Core Ultra 7 366H, a Series 3 Panther Lake part with 16 cores and
Two of the three big memory makers are putting money into U.S. semiconductor infrastructure at opposite ends of the production chain. Micron committed up to $3 billion to domestic supply-chain investments in July, anchored by a raw silicon wafer deal in Texas, while SK hynix is preparing to break ground on its advanced HBM packaging
HCLTech and NetApp have expanded their strategic partnership to deliver an integrated hybrid cloud Storage-as-a-Service (STaaS) platform tailored for enterprise artificial intelligence, generative AI, and high-performance data architectures. It is the latest in a run of NetApp moves aimed at AI data pipelines, following its DataPelago acquisition in July. The offering links infrastructure consumption with
Dell has qualified KIOXIA’s 245.76TB NVMe SSDs for software-defined ObjectScale, putting 9.83PB of raw flash in a single 2U server. The density milestone lands on top of the data-path work Dell detailed earlier this year across ObjectScale 4.2 and 4.3, which targets high-throughput AI training, small-object pipeline efficiency, and inference acceleration through native S3 over
NVIDIA has moved Spectrum-X Ethernet Photonics, its co-packaged optics (CPO) Ethernet switch platform, into full production. The company puts the gains at 4x fewer lasers, 5x lower power consumption, and 10x higher mean time between incidents, and it named the five manufacturing partners building the switch at each stage of the supply chain. The milestone
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