Today Dell EMC announced major software updates to its Unity and SC Series. For Unity, the company is updating to Operating Environment (OE) 4.4 that brings a boost in file-based replication and data mobility as well as new security capabilities for block and file workloads. Dell EMC is also announcing that it has shipped 1
Today Druva announced that it is integrating its recently acquired CloudRanger into its Data Management-as-a-Server Solution, Druva Cloud Platform (DCP). Now DCP will unify all of the company’s product offerings into a single point of management that Druva states will enable organizations to centrally protect, manage and gain visibility into their entire data footprint. With
Today Hewlett Packard Enterprise (HPE) announced that it is adding new features to its popular 3PAR storage. HPE is adding its new version of InfoSight that leverages AI and automation for the data center. The company states that this will lead to better productivity and efficiency while unlocking the economic value of data.
Toshiba has announced the XG6, the market’s first SSD built on 96-layer 3D TLC BiCS FLASH memory. The XG6 fits right in the middle of Toshiba’s client portfolio as their newest mainstream NVMe entry, replacing the impressive XG5, targeted towards client PCs, high-performance mobile device, gaming segments and embedded use cases. The XG6 is also ideal
Both companies announced QLC, 96-Layer, FLASH memory chips on July 19th. Toshiba and Western Digital are both expecting 1.33Tb (terabits) of storage per chip. Western Digital’s announcement covers that the chip was jointly developed with Toshiba in Yokkaichi, Japan. However, Toshiba’s announcement makes no mention of Western Digital at all. Possibly a sign of lingering poor
Intel did a curious thing July 19th. It announced that they were now producing their QLC PCIe SSD on their Twitter news account with almost no accompanying details. Since then, Intel has released little additional information but it has confirmed that this will be part of Intel’s new D5 product family for data centers. We expect to learn more
Lenovo – together with Cloudistics – is further expanding its ThinkAgile portfolio with the CP series. Billed as a composable cloud platform or a ‘cloud-in-a-box’; the CP series aims to offer customers looking for the agility of the public cloud and the security of a private cloud all the conveniences and ease-of-use of a public
Today HP Inc. unveiled what it is calling the world’s most powerful entry workstations, with its updated HP Z Workstation lineup. These new entry workstations are aimed at product designers, architects, creative professionals, OEMs, educators, and financial workers. HP states that the new workstations will provide enhanced productivity and performance while being cost-effective and secure.
Today at its annual AWS Summit in New York, AWS announced a new high frequency instance for Amazon Elastic Compute Cloud, Amazon EC2 Z1d. Z1d is designed for users that need the highest single-thread performance with a large amount of memory (such as electronic design automation (EDA), relational databases, and financial simulations). AWS is also
Samsung are the first to announce that they have successfully developed a 10-nanometer class (process node between 10 and 20 nanometers). This announcement is not only ahead of Samsung’s competitors, but also ahead of the finalization of the specifications for DDR5 & LPDDR5. JEDEC, the standards group for the microelectronics industry, is still forecasting the release of
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