StorageReview.com
StorageReview Podcast 152 cover: Liquid Cooling at Scale with Tim Shedd, over a Dell PowerCool CDU rack row
Data Protection  ◇  Enterprise

Podcast #152: Data Center Thermal Dynamics and Cooling Architectures With Tim Shedd

Brian recently caught up with Tim Shedd, an expert in thermal management and a pioneer in liquid cooling technologies. The podcast covers some of the historical aspects of data center liquid cooling, from Tim’s time working with Cray and spraying liquid across tubes to his more recent engagement with Dell’s PowerEdge XE9680.  Tim Shedd

NVIDIA render of the Jetson Orin Nano 2 developer kit on a workbench beside a laptop and a small robotic arm
AI  ◇  Enterprise

NVIDIA Jetson Orin Nano 2: 78 TOPS and 2x the Inference of Its Predecessor, Arriving First Half of 2027

NVIDIA has announced the Jetson Orin Nano 2, an updated system-on-module and developer kit engineered to run compact foundation models and real-time computer vision workloads at the edge. The release targets embedded robotics, unmanned aerial vehicles, and industrial edge devices that require local inference capabilities without relying on continuous cloud connectivity. “Today’s small and medium

TerraMaster T9 500 Pro
Enterprise  ◇  Medium NAS

TerraMaster Stacks Five BBS Backup Servers From $899.99, With Dual 10GbE and TOS 7 Across the Line

TerraMaster is expanding its enterprise storage efforts around a group of rackmount and tower NAS systems designed for centralized backup, data protection, video surveillance storage, and other business workloads, a step up in ambition from the consumer NAS and Thunderbolt storage the brand is better known for. The current lineup includes the U4-500, U8-500 Plus,

Rows of GPU compute racks in a data center aisle, the kind of rack-scale deployment Cisco Secure AI Factory with NVIDIA targets
AI  ◇  Enterprise

Cisco Secure AI Factory Adds Supermicro Rack-Scale Compute, With Vera Rubin NVL72 Support and October Availability

Cisco is broadening its Secure AI Factory with NVIDIA initiative by adding Supermicro as a compute partner, incorporating Supermicro’s liquid- and air-cooled systems into Cisco’s full-stack AI infrastructure architecture. The expansion targets enterprise, neocloud, and sovereign cloud customers building out large-scale AI deployments. “We are at the beginning of one of the largest datacenter buildouts

Enterprise  ◇  Enterprise Storage

IBM DS8000 Release 10.2 Brings FCM5 in EDSFF, Doubled Back-End Throughput, and Automated Ransomware Containment

IBM has announced the IBM Storage DS8000 Release 10.2, an update to its flagship enterprise storage platform tailored for IBM Z, IBM LinuxONE, and high-performance, mission-critical environments. The release targets large-scale enterprise demands by focusing on increased drive density, deeper operational telemetry, and automated cyber resilience. Fifth-Generation FlashCore Module (FCM5) Release 10.2 introduces the fifth-generation

NVIDIA render of a custom XPU package with NVHBM memory stacks flanking the compute dies
AI  ◇  Enterprise

NVIDIA NVHBM Moves the Memory Controller Into the HBM Stack, With Amazon’s Trainium4 First in Line

Hyperscalers and AI-focused infrastructure operators are increasingly developing proprietary AI accelerators and XPUs to keep pace with large language models and complex reasoning workloads. To address the physical, memory, and networking challenges of deploying proprietary silicon at scale, NVIDIA has detailed its NVLink Fusion interconnect and NVHBM custom base-die memory architecture. The unified portfolio is

NVIDIA Vera CPU module render with two compute dies surrounded by memory packages
Cloud  ◇  Enterprise

AWS and NVIDIA to Deploy 2 Million More GPUs in 2027-2028, Bringing Vera CPUs and Custom NVHBM to Trainium

Amazon Web Services and NVIDIA have announced a major expansion of their joint infrastructure initiatives, outlining plans to deploy an additional 2 million NVIDIA GPUs across AWS data centers between 2027 and 2028. Building on a 16-year engineering relationship, the expanded collaboration targets end-to-end scaling of AI infrastructure, encompassing accelerator capacity, host CPU architectures, high-bandwidth

Stylized render of a multi-die chiplet package on a circuit board, illustrating the modular silicon approach AMD is bringing to Versal
Accessories  ◇  Enterprise

AMD Versal RF Gets Native UCIe 1.1: Six Chiplet Links per Package, Production Parts in Q4 2027

AMD announced that its upcoming Versal adaptive SoCs will natively support Universal Chiplet Interconnect Express (UCIe) 1.1 interfaces. The open industry standard, which Intel is also building into Diamond Rapids and Wildcat Lake, establishes low-power, high-bandwidth die-to-die communication, allowing co-packaged AMD adaptive SoCs to interface directly with specialized silicon. This transition targets the engineering constraints

AI  ◇  Enterprise

Nutanix Ships Enterprise AI 2.8 With a GA MCP Gateway as NKP 2.19 Rounds Out the Dual-Native Pitch

Nutanix has announced the general availability of Nutanix Enterprise AI (NAI) 2.8 alongside the upcoming release of Nutanix Kubernetes Platform (NKP) 2.19. The updates focus on bridging the gap between legacy virtualized environments and modern containerized AI workloads. By implementing a dual-native architecture, Nutanix aims to allow organizations to run virtual machines and containerized AI