Toshiba has announced the XG6, the market’s first SSD built on 96-layer 3D TLC BiCS FLASH memory. The XG6 fits right in the middle of Toshiba’s client portfolio as their newest mainstream NVMe entry, replacing the impressive XG5, targeted towards client PCs, high-performance mobile device, gaming segments and embedded use cases. The XG6 is also ideal

Both companies announced QLC, 96-Layer, FLASH memory chips on July 19th. Toshiba and Western Digital are both expecting 1.33Tb (terabits) of storage per chip. Western Digital’s announcement covers that the chip was jointly developed with Toshiba in Yokkaichi, Japan. However, Toshiba’s announcement makes no mention of Western Digital at all. Possibly a sign of lingering poor

Intel did a curious thing July 19th. It announced that they were now producing their QLC PCIe SSD on their Twitter news account with almost no accompanying details. Since then, Intel has released little additional information but it has confirmed that this will be part of Intel’s new D5 product family for data centers. We expect to learn more

Lenovo – together with Cloudistics – is further expanding its ThinkAgile portfolio with the CP series. Billed as a composable cloud platform or a ‘cloud-in-a-box’; the CP series aims to offer customers looking for the agility of the public cloud and the security of a private cloud all the conveniences and ease-of-use of a public

Today HP Inc. unveiled what it is calling the world’s most powerful entry workstations, with its updated HP Z Workstation lineup. These new entry workstations are aimed at product designers, architects, creative professionals, OEMs, educators, and financial workers. HP states that the new workstations will provide enhanced productivity and performance while being cost-effective and secure. 

Today at its annual AWS Summit in New York, AWS announced a new high frequency instance for Amazon Elastic Compute Cloud, Amazon EC2 Z1d. Z1d is designed for users that need the highest single-thread performance with a large amount of memory (such as electronic design automation (EDA), relational databases, and financial simulations). AWS is also

Samsung are the first to announce that they have successfully developed a 10-nanometer class (process node between 10 and 20 nanometers). This announcement is not only ahead of Samsung’s competitors, but also ahead of the finalization of the specifications for DDR5 & LPDDR5. JEDEC, the standards group for the microelectronics industry, is still forecasting the release of

Today Commvault announced that its had taken several of its solutions and offerings and consolidated them into simple product packages and pricing. The announcement today take the breadth of Commvault’s offerings and boils them down to four products aimed for complete, scalable backup and recovery as well as data management, regardless of the size of the

Today Unitrends released the new Gen 8 version of its flagship Recovery Series backup appliances. The latest version of the hardware appliances have built-in efficiencies that are designed to increase density, reduce power and cooling, and help customers save on costs. The Gen 8 Recovery Series are also pre-integrated with Unitrends Backup 10.2 software that