AMD has announced the general availability of 3rd-gen AMD EPYC processors with AMD 3D V-Cache technology (previously codenamed “Milan-X”), the world’s first data center CPU that leverages 3D die stacking. These new processors feature the Zen 3 core architecture and expand on the already impressive 3rd Gen EPYC portfolio. Compared to non-stacked 3rd-Gen EPYC processors,













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