Today at FMS 2019, Xilinx, Inc. announced that it is expanding its Alveo data center accelerator card portfolio with the launch of the Alveo U50. Xilinx states that the U50 is the first low profile adaptable accelerator with PCIe Gen 4 support. The company goes on to state that the card can supercharge a broad

Today Smart IOPS announced its new NVMe SSD geared towards the Storage Class Memory (SCM) market, Unobtanium FN. The new SSDs leverage Toshiba’s XL-Flash technology and come in capacities ranging from 800GB to 3.2TB. Smart IOPS will be demoing Unobtanium FN at Flash memory Summit 2019 from August 6 to August 8, at Booth Number

Today Excelero announced its new block storage software that its states can create NVMe all-flash arrays from high-availability servers, Excelero NVEdge. Excelero, as it frequently does, claims that its new solution can create the world’s fastest NVMe AFA performance, with the numbers they claim being 2.7 million IOPS on a 100Gb link. Even though they

Today at the Flash Memory Summit, Liqid announced what it is calling the world’s fastest NVMe storage, Liqid Element LQD4500 PCIe Add-In-Card (AIC) or Honey Badger. The Element LQD4500 is a FHFL AIC that is ultra-thin and is based on Liqid’s award-winning composable fabric and software. The NVMe takes advantage of Gen 4 PCIe specifications

Today Intel announced that its future Intel Xeon Cooper Lake processor family will have server-centric versions with up to 56 cores per socket. The new processors have built-in, AI training acceleration.

Today Toshiba introduced a new form factor for NVMe memory devices, the XFMEXPRESS. The new form factor will be for flash memory devices and fall in between the M.2 and BGA categories. While there is a slew of potential use cases for such a form factor, it will be of particular interest to OEMs of

Samsung has started the mass production of 250GB SATA SSDs that integrate the company’s 6th-gen (1xx-layer) 256Gb 3bit V-NAND for global PC OEMs. With its ‘channel hole etching’ technology, Samsung indicates that the new V-NAND adds approximately 40% more cells to the previous 9x-layer single-stack structure. This is done by building an electrically conductive mold

Today Intel announced a new high-performance FPGA Programmable Acceleration Card, the Intel FPGA PAC D5005. Currently, Intel is working with Hewlett Packard Enterprise (HPE) providing the new card for this ProLiant DL380 Gen10 server. The combination of the two technologies is aimed at address computing-intensive markets such as streaming analytics, media transcoding, financial technology and

Today Toshiba memory America, Inc. announced the launch of its Storage Class Memory (SCM) solution, XL-FLASH. XL-FLASH is based off of Toshiba’s BiCS FLASH 3D flash memory technology with 1-bit-per-cell SLC. The new SCM technology aims to bring high performance to the enterprise while cost-effectively reducing latency.